Magni tal-Qtugħ tal-Laser Picosecond Ultravjola

Il-magna tat-tqattigħ tal-lejżer picosecond ultravjola tuża laser ultravjola picosecond (<15ps) with a laser wavelength of 355nm. It's suitable for high-speed laser etching, peeling, etching, scribing, dicing, material removal, and fabrication on various material surfaces. Simultaneously, it can perform micro-machining such as scribing and grooving on the surfaces of materials such as silicon wafers, ceramics, sapphire, glass, metals, and polymer materials, meeting the cutting and drilling needs of ultra-thin materials (metals, carbon fibers, glass, silicon wafers, PET, PI, composite materials, etc.). It is the ultimate manufacturing tool for cutting-edge fields such as precision electronics, biomedicine, and scientific research.

It-tagħmir tal-ipproċessar tal-mikro-nano laser ultravjola picosecond huwa mgħammar b'lejżer picosecond ultravjola ta '30W. Juża softwer ta 'kontroll żviluppat b'mod indipendenti biex jaġġusta l-galvanometru u l-mutur lineari f'ħin reali. Wara l-importazzjoni tad-dejta CAD, is-sistema ta 'pożizzjonament tal-viżjoni CCD awtomatikament tiċċirkola l-lejżer. Flimkien ma 'mozzjoni u sistema ottika ta' ultra-preċiżjoni, sistema ta 'monitoraġġ u kontroll intelliġenti, worktable ta' l-irfigħ elettriku, u sistema unika ta 'tneħħija tat-trab, tikseb kwalità ta' pproċessar qrib-perfetta.

Il-vantaġġi teknoloġiċi doppji tal-UV + picosecond: Enerġija foton għolja tkisser direttament ir-rabtiet kimiċi tal-materjali, u tikseb ipproċessar "kiesaħ"; Daqs tal-post iffukat estremament żgħir, assorbiment għoli għal ħafna materjali, li jelimina l-karbonizzazzjoni waqt l-ipproċessar; Wisa' tal-polz tal-picosekondi (<15ps), heat-affected zone approaches zero, materials are directly vaporized and removed without microcracks, maintaining the original mechanical properties of the material.